Vol 4 , Issue 2 , April - June 2016 | Pages: 149-158 | Research Paper
Received: January 25, 2016 | Revised: February 20, 2016 | Accepted: February 28, 2016 | Published Online: June 15, 2016
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The paper represents the modeling of nano scale gold film thickness deposited by thermal evaporation process. Gold is evaporated from a resistively heated boat at a temperature of 1900 K onto a surface held on a fixed surface. The incident molecular flux onto the silicon surface is 7.86x1019 (1/m2sec). The thickness varies between 78 nm and 80 nm across the sample after 60 s of deposition, with radial symmetry about the midpoint of the source. The film thickness, mass deposited on the substrate and mass transfer rate on silicon substrates with time dependent model using BDF solver is calculated. The SEM micrographs shows the smooth and uniformly distributed nano scale gold film on silicon and the average grain size of gold is 15-30 nm. The XRD analysis shows the polycrystalline face centered cubic (fcc) structure in preferential (111) plane. Deposited gold film thickness measured from Dektek surface profiler at different points on the substrate surface
Keywords
Physical Vapor Deposition; Modeling; Film Thickness Simulation; Thin Film Deposition; Vacuum