Journal Press India^®

Author Details ( * ) denotes Corresponding author

In recent years, cost-effective compact size devices with high processing speed are made for a sharp rise in the electronics market. To compensate for the high heat fluxes produced in the device, heat sinks are extensively used. In this research, study of active plate heat sink using different slope angle without changing surface area and mass is carried out with the help of CFD tool. The methodology used in this study is the 3D CAD modeling using SOLIDWORKS software and CFD simulation using STAR-CCM+ software. Navier-Stocks equations are solved by using the conjugate heat transfer method. To establish a validation case, the numerical result obtained from this study is compared with the experimental results of the previous research paper. From the results, maximum temperature and thermal resistance performance of 7.5° slope geometry is increased by 1.57% and 16.87% respectively and pressure drop performance of 10° slope geometry is increased by 65.37%. Another considerable factor is the temperature profile at the bottom of the sloped heat sink geometries, which is more uniformly centered in case of 7.5° and 10° slope. The conclusion stated that the angular sloped geometries provides better result than the traditional plate heat sink geometry.

Keywords

Computational Fluid Dynamics, Active heat sink, performance parameters, slope angle, governing equations.

1. B Freegah, AA Hussain, AH Falih, H Towsyfyan. CFD analysis of heat transfer enhancement in plate-fin heat sinks with fillet profile: investigation of new designs, Thermal Science and Engineering Progress, 2019.


2. S Lee, M Early, M Pellilo. Thermal interface material performance in microelectronics packaging applications, Microelectronics, 28(1), 1997, 13-20.


3. B Xia, DW Sun. Applications of computational fluid dynamics (CFD) in the food industry: a review, Computers and Electronics in Agriculture, 34, 2002, 5-24.


4. S Subramanyam, KE Crowe. Rapid design of heat sinks for electronic cooling using computational and experimental tools, Institute of Electrical and Electronics Engineers, 16, 2000, 243-251.


5. R Arularasan, R Velraj. CFD analysis in a heat sink for cooling electronic devices, International Journal of the computer, the internet and management, 6, 2008, 1-11.


6. H Sivasankaran, G Asirvatham, J Bose, B Albert. Experimental analysis of parallel plate and cross cut pin fin heat sinks for electronics cooling applications, Thermal Science, 14(1), 2010, 147-156.


7. P Rodgers, V Eveloy. Air cooled heat sink design optimization in free convection, 29th IEEE Semiconductor Thermal Measurement and Management Symposium, 2013, 170-172.


8. D Gupta, V Venkataraman, R Nimje. CFD & Thermal Analysis of Heat Sink and its Application in CPU”, International Journal of Emerging Technology and Advanced Engineering, 4(8), 2014, 198-202.


9. SS Haghighi, HR Goshayeshi, MR Safaei. Natural convection heat transfer enhancement in new designs of plate-fin based heat sinks, International Journal of Heat and Mass Transfer, 125, 2018, 640-647.


10. CK Loh, DJ Chou. Comparative analysis of heat sink pressure drop using different methodologies, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2004, 6